Lead solder paste is essentially a well-engineered mixture of a flux, which acts as the medium, and a solder powder. There is not just one kind of solder paste; since it can be engineered, it can be made to display any rheological property by changing the flux and the metals in the solder powder. For different soldering applications, a different consistency of flux is required. Here are three primary functions of lead (Pb) solder paste.
Function #1: Cleaning
Solder paste, with liquid flux as a medium, is semisolid and has another very important function – to clean the area of oxides. Stenciling typically deposits solder paste over the intended areas only, therefore cleaning achieved is also very accurate and effective.
Function #2: Adhesion
Solder paste application on a printed circuit board is also intended to act as an adhesive to hold the components in place until the board is heated to start soldering. Solder paste is capable of keeping the components immobile until a connection is forged.
Function #3: Connection
Solder paste consists of metals that assist in bonding of two surfaces. When heated during soldering, the solder paste melts and achieves a mechanical and electrical connection on the board between the intended components.
Solder paste is an integral part of soldering process and should be executed with care and precision if an effective bond is to be achieved and soldering defects avoided.
Function #1: Cleaning
Solder paste, with liquid flux as a medium, is semisolid and has another very important function – to clean the area of oxides. Stenciling typically deposits solder paste over the intended areas only, therefore cleaning achieved is also very accurate and effective.
Function #2: Adhesion
Solder paste application on a printed circuit board is also intended to act as an adhesive to hold the components in place until the board is heated to start soldering. Solder paste is capable of keeping the components immobile until a connection is forged.
Function #3: Connection
Solder paste consists of metals that assist in bonding of two surfaces. When heated during soldering, the solder paste melts and achieves a mechanical and electrical connection on the board between the intended components.
Solder paste is an integral part of soldering process and should be executed with care and precision if an effective bond is to be achieved and soldering defects avoided.
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