For those who are new to the world of electronic assembly, solder paste is that grey goo-like material that comes in a tub or tube and has the consistency of cake frosting. For those who want to get into the details of this substance, solder paste is power metal solder that is suspended in a thick viscose medium known as flux. This medium does two things – it holds together the components that are being soldered and it scours the surfaces of impurities to ensure that a strong and reliable solder joint is formed between them. Let’s explore solder paste further and understand its application in SMT and SMD processes.
Applications of solder paste
Solder paste is extensively used in industrial scale for SMT and SMD production where accurate application of solder alloy to components needs to be managed efficiently and effectively. It is especially advantageous for miniaturized circuit assemblies that are used in handheld electronic devices like smart phones, tablets, computer motherboards, military electronics, automotive systems, medical equipment and more. It is also used in through-hole, pin-in-paste components where the paste is applied and spread in/over the holes in a printed circuit board with the help of a squeegee. This flux medium, being sticky, holds the components in place while the PCB is heated or baked till the metal components in the solder paste melt and form strong mechanical and electrical joints between intended surfaces.
Composition of solder paste
The composition of solder paste varies based on the properties expected from it for the specific SMT and SMD processes where it will be used. For example, soldering plastic component packages to glass epoxy circuit boards requires the use of solder paste with Sn/Pb or Sn/Ag/Cu compositions. High shear strength requirements are suitable to Sn/Pb combination alloys. The solder melting temperature suitable for a particular PCB assembly process also has an impact on which solder paste will work best for your requirements. Solder paste also differs in accordance with the size of the alloy particles that are suspended in the flux paste. The specific features of your PCB printing process and print quality expected from the paste will determine the metal particle size that will best work for your application. The type of flux medium used in the paste (rosin based, water soluble or no-clean) also categorizes the product, again impacting the way your PCB printing and manufacturing process will work.
Hope this information helps further your understanding of solder paste and its importance in the world of PCB manufacturing.
Applications of solder paste
Solder paste is extensively used in industrial scale for SMT and SMD production where accurate application of solder alloy to components needs to be managed efficiently and effectively. It is especially advantageous for miniaturized circuit assemblies that are used in handheld electronic devices like smart phones, tablets, computer motherboards, military electronics, automotive systems, medical equipment and more. It is also used in through-hole, pin-in-paste components where the paste is applied and spread in/over the holes in a printed circuit board with the help of a squeegee. This flux medium, being sticky, holds the components in place while the PCB is heated or baked till the metal components in the solder paste melt and form strong mechanical and electrical joints between intended surfaces.
Composition of solder paste
The composition of solder paste varies based on the properties expected from it for the specific SMT and SMD processes where it will be used. For example, soldering plastic component packages to glass epoxy circuit boards requires the use of solder paste with Sn/Pb or Sn/Ag/Cu compositions. High shear strength requirements are suitable to Sn/Pb combination alloys. The solder melting temperature suitable for a particular PCB assembly process also has an impact on which solder paste will work best for your requirements. Solder paste also differs in accordance with the size of the alloy particles that are suspended in the flux paste. The specific features of your PCB printing process and print quality expected from the paste will determine the metal particle size that will best work for your application. The type of flux medium used in the paste (rosin based, water soluble or no-clean) also categorizes the product, again impacting the way your PCB printing and manufacturing process will work.
Hope this information helps further your understanding of solder paste and its importance in the world of PCB manufacturing.
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