Friday 24 November 2017

PROS AND CONS OF SOLDER PASTE STENCILS

All electronic devices have a printed circuit board fit into them. It is the most basic component, needed for all electronics to function the way they are meant to. Printed circuit boards are manufactured with high precision, which, today, is made possible through the usage of solder paste stencils. A stencil is a device which is made from a thin foil or filament, which is cut either manually or robotically, in accordance with the design of the printed circuit board. This stencil is especially useful for application of solder paste onto the board, which aids further processes. This blog discusses the pros and cons of solder paste stencils.

Pros
 
•    Stencils are extremely easy to set-up and use. For a mass-manufacturing process, stencils are extremely useful and economical because a single stencil can be reused for multiple solder paste applications.

•    Stencils allow on-contact and off-contact printing on printed circuit boards.

•    Stencils allow usage of a wider range of viscosities of solder pastes.

•    Stencils are extremely easy to clean.

•    Stencils do not plug up easily.

•    Stencils are extremely convenient to use in cases of multilevel printing of circuit boards.

Cons
 
•    Stencils may increase cost of production where the design of circuit boards changes frequently.

•    They require proper maintenance and storage in order for them to keep functioning properly as the material they are made of may bend and disturb the aperture or openings, which may create problems while printing and result in defected products.

Stencils enable a highly efficient production of printed circuit boards. If you own a PCB manufacturing facility, using stencils will be highly profitable for you.

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