The RoHS (Restriction of Hazardous Substances) directive changed the way most electronics and electrical equipment are manufactured, and one of the most important changes is the use of lead-free alloys in making solder joints. Wave soldering is still one of the preferred methods for mass-production of printed circuit boards, but traditionally, the alloy used was tin/lead (Sn63/Pb37). Now, with the increased availability of lead-free solder bar options, it is possible for manufacturers to conduct lead-free soldering more easily and economically. Solder typically has a melting point that ranges from 90 °C to 450°C for most sheet metal work and electronics. However, lead-free replacements for 63/37 and 60/40 tin-lead solders can melt between temperature ranges of 5°C to 20°C or higher.
Tin-silver-copper (SAC or Sn-Ag-Cu) solders are preferred by some manufacturers for wave soldering and reflow because of the reduced melting point, which is around 217°C for SAC alloys. Sn95.5Ag4Cu0.5 and Sn96.5Ag3Cu0.5 are some of the best lead-free alloys to replace the Sn63 alloy in wave soldering processes. Depending on the conditions of the process, those SAC alloys may reduce or stabilize the copper content in a wave solder bath. A high-quality lead-free solder alloy is created using a specialized process to eliminate oxides and other impurities.
Lead-free solder alloys have a range of features that can make it beneficial for lead-free soldering. One of its most notable benefits is the best in class yield that outperforms other materials that are based on Sn/Cu. The solder possesses faster wetting speeds (at only 0.65 seconds), which was tested against Sn/Cu-based materials (1 second), making it highly solderable. The way the alloy is manufactured and conditioned helps reduce dross generation. The solder bar promotes excellent drainage, too, so it lowers the chances of bridging while delivering excellent performance when used on different flux technologies.
Tin-silver-copper (SAC or Sn-Ag-Cu) solders are preferred by some manufacturers for wave soldering and reflow because of the reduced melting point, which is around 217°C for SAC alloys. Sn95.5Ag4Cu0.5 and Sn96.5Ag3Cu0.5 are some of the best lead-free alloys to replace the Sn63 alloy in wave soldering processes. Depending on the conditions of the process, those SAC alloys may reduce or stabilize the copper content in a wave solder bath. A high-quality lead-free solder alloy is created using a specialized process to eliminate oxides and other impurities.
Lead-free solder alloys have a range of features that can make it beneficial for lead-free soldering. One of its most notable benefits is the best in class yield that outperforms other materials that are based on Sn/Cu. The solder possesses faster wetting speeds (at only 0.65 seconds), which was tested against Sn/Cu-based materials (1 second), making it highly solderable. The way the alloy is manufactured and conditioned helps reduce dross generation. The solder bar promotes excellent drainage, too, so it lowers the chances of bridging while delivering excellent performance when used on different flux technologies.
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