Solder paste is used in PCB assembly and prototyping, and it is particularly helpful when the reflow soldering method is involved. It is typically composed of solder spheres and a specially formulated flux. Solder paste is applied on the surface of a PCB to create a physical and electronic bond between components and the printed circuit board. However, the process of soldering typically leaves a residue, which needs to be cleaned to maintain a seamless appearance. No-clean solder paste is formulated to help minimize or completely eliminate the need to clean via scrubbing or using a vapor degreaser or petroleum solvent.
No-clean solder paste can be handy in reflow and fine feature printing applications. It can be used in the most demanding manufacturing processes where soak reflow profiles are exposed to nitrogen and air. The excellent reflow process window of a lead-free and no-clean solder paste ensures excellent soldering on applications like lead-free HASL (hot air solder leveling) and ENIG (electroless nickel immersion gold) surface finishes, immersion Sn, Immersion Ag, and OSP-Cu. When choosing this type of solder paste, make sure that it complies with IPC Class III voiding classifications and ROLO IPC to ensure maximum product reliability in the long run. It’s also important to make sure that it complies to environmental standards, like RoHS (Restriction of Hazardous Substances).
Using a no clean solder paste can help speed up the assembly process. Excellent paste-in-hole or pin-in-paste performance has been proven for pin transfer or dispensing applications and printing. The long stencil life ensures consistent performance for a minimum of six hours of continuous printing, even if you do not apply new paste, and up to 24 hours in SMT production from 20°C to 32 °C in harsh environments. The paste is formulated to stand up to difficult wetting requirements in lead-free components, like QFN and CSP on various lead-free board finishes.
No-clean solder paste can be handy in reflow and fine feature printing applications. It can be used in the most demanding manufacturing processes where soak reflow profiles are exposed to nitrogen and air. The excellent reflow process window of a lead-free and no-clean solder paste ensures excellent soldering on applications like lead-free HASL (hot air solder leveling) and ENIG (electroless nickel immersion gold) surface finishes, immersion Sn, Immersion Ag, and OSP-Cu. When choosing this type of solder paste, make sure that it complies with IPC Class III voiding classifications and ROLO IPC to ensure maximum product reliability in the long run. It’s also important to make sure that it complies to environmental standards, like RoHS (Restriction of Hazardous Substances).
Using a no clean solder paste can help speed up the assembly process. Excellent paste-in-hole or pin-in-paste performance has been proven for pin transfer or dispensing applications and printing. The long stencil life ensures consistent performance for a minimum of six hours of continuous printing, even if you do not apply new paste, and up to 24 hours in SMT production from 20°C to 32 °C in harsh environments. The paste is formulated to stand up to difficult wetting requirements in lead-free components, like QFN and CSP on various lead-free board finishes.
No comments:
Post a Comment