Solder paste is used for printed circuit boards assembly. That solder paste material is used to link surface mount components to the pads on PCBs and keeps those parts in place. Its main purpose is to form a mechanical bond between the parts and the board and to also form an electrical connection between the circuit board and electronic components. Paste is applied to a PCB, and the parts are placed manually or by using a pick-and-place machine. There are a variety of solder pastes available for various soldering applications. It is important to have proper equipment and tools for applying the paste on the PCB to avoid soldering defects.
Most of the defects and issues in circuit board assembly are the result of either using a defective solder paste, using the wrong type of solder paste or the improper application of the solder paste. One of the more common soldering defects is bridging, which occurs when the solder melts over more than one joint and forms unintended connection. Too much solder, or insufficient/poor wetting can also result in soldering defects. Conventional solder pastes are formulated with lead, but lead-free variants, which, when used improperly, may cause head-in-pillow defects, solder paste deposits, and incomplete coalescence of BGA (ball grid array).
Solder paste particles are traditionally made up of lead and tin. Lead-free solders can be formulated from SAC alloys for HiP reduction and miniaturized electronics to ensure high throughput and reliability. Low temperature reflow lead-free solder pastes are designed to enhance the performance of the solder joint for thermal cycling and drop shock to create better joints with improved cosmetics and mechanical properties. Universal, high print speed electronic solder pastes have a no-clean formulation for a wide range of applications, especially those that require repeatability and high throughput.
Most of the defects and issues in circuit board assembly are the result of either using a defective solder paste, using the wrong type of solder paste or the improper application of the solder paste. One of the more common soldering defects is bridging, which occurs when the solder melts over more than one joint and forms unintended connection. Too much solder, or insufficient/poor wetting can also result in soldering defects. Conventional solder pastes are formulated with lead, but lead-free variants, which, when used improperly, may cause head-in-pillow defects, solder paste deposits, and incomplete coalescence of BGA (ball grid array).
Solder paste particles are traditionally made up of lead and tin. Lead-free solders can be formulated from SAC alloys for HiP reduction and miniaturized electronics to ensure high throughput and reliability. Low temperature reflow lead-free solder pastes are designed to enhance the performance of the solder joint for thermal cycling and drop shock to create better joints with improved cosmetics and mechanical properties. Universal, high print speed electronic solder pastes have a no-clean formulation for a wide range of applications, especially those that require repeatability and high throughput.
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