How No-Clean Solder Paste Helps in Speeding Up the Assembly Process

The assembly process can be tedious and time-consuming, but you can improve it with the right materials and solutions, like the no-clean solder paste. It is practical for reflow and ultra-fine feature printing applications, but unlike conventional liquid fluxes or pastes, the no-clean variant may speed up the process of soldering for higher throughput. Cleanable solder paste material prints and reflows Type 5 and Type 4 powder to meet the requirements of processes in ultra-fine applications. The best formulations of a no-clean flux has a sufficient reflow process window to provide reliable soldering on CuOSP, with superb coalescence on various deposit sizes. Moreover, they display excellent mid-chip and random solder ball resistance.

No-clean solder paste ensures good print volume deposit, which can be repeated numerous times without fail. This way, it provides value to your soldering process when it reduces the risk of defects, which typically come from variability in the print process. The printing performance is considered excellent, but in case of residue after the reflow, it can easily be removed or cleaned with relevant cleaners or nPB-based solvents.

A no-clean flux can add a level of safety to manufacturers and workers involved in the soldering and assembly process, as it contains no halogen or lead. It is also designed for Type 5 and Type 4 powders. Cleanable solder paste provides longer stencil life, as it ensures consistent results to reduce paste dry-out and variations in the print performance. High tack force life guarantees higher pick-and-place yields and proper self-alignment, and the wide reflow profile window makes the product useful in soldering high-density and complex PWB assemblies in N₂ environments with high ramp rates, and a soak profile as high as 170° Celsius to 180° Celsius.

There are many other benefits to using a no-clean solder paste, including better coalescence and enhanced wetting performance, and excellent flux residue and solder joint cosmetics. The formulation complies with TOSCA, halogen-free requirements, EINECS, and RoHS, so it is considered environmentally friendly and safe.