Going lead-free may be the best in certain
applications where safety and reliability are prioritized, and when the
assembly process can be compatible with it. The lead-free solder bar is one of the most flexible products,
particularly if it is developed and formulated by an established and reputable company
that provides soldering solutions. This way, you can be confident in using
technologically advanced solder products that offer high throughput applications
and high reliability. Here are some of the important things to learn about
lead-free solder bars:
- The
composition – Leading lead-free
solder bar can be made of Sn95.5Ag4Cu0.5 or Sn96.5Ag3Cu0.5, with
replenishment alloys being Sn96.5Ag3.5Cu0, Sn96Ag4Cu, and Sn97Ag3Cu0, all
of which are lead-free alloys that are safe replacements for the Sn63
alloy. Replenishment alloys stabilize on the reduction of copper content
during wave soldering, depending on the conditions of the process.
- It
removes impurities – The alloying process in high-quality lead-free solder
bars eliminate oxides and other impurities that can affect the quality of
the joints. Alloy conditioning helps reduce dross generation, too.
- Increase
yield – A good lead-free solder
bar ensures the best in class yield that may surpass the quality of
performance of Sn/Cu-based materials. Faster wetting helps speed up the
manufacturing process and solderability for higher throughput and
increased productivity. Excellent drainage minimizes the chances of bridging,
unlike when you use certain types of Sn/Cu alloys. This way, it delivers
dependable performance across various flux technologies.
- Helpful
to electronic assemblers going lead-free – Lead-free
solder bar works with lead-free surface mount and wave
soldering applications.
- Recommended
temperatures – You need to make sure that the solder pot temperature is
within the range of 491 to 509° Fahrenheit (255° to 265° Celsius). The
manufacturer should be able to provide a guide to help you select the
right solder bar for your application.
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