Soldering components together is a key part of the electronics manufacturing process. However, there are many facets that can hamper the bond between circuitry components, causing defects and malfunction in the surface mount device (SMD). An improperly formed solder joint is unreliable, brittle and may even be incapable of surviving through the thermal and mechanical fatigue that it will be subjected to, as a result of everyday use of the circuit. Preventing such occurrences is therefore, a prime concern for PCB manufacturers. Liquid solder flux plays an exceedingly important role in maintaining the integrity of any soldered bond and ensuring high quality of the circuit board produced.
What Does Liquid Solder Flux Do?
The process of soldering requires the formation of a metallurgical bond between two surfaces which chemically react with each other to achieve a stable and reliable bond. This bond is only possible when:
a. The solder alloy is chemically compatible with the surfaces being bonded together, and
b. The surfaces are free of any impurities that may physically and chemically hamper the formation of a good bond.
Point (b) in the assembly process is the responsibility of the liquid solder flux. Flux is a chemical that is applied to the surfaces being bonded together before application of the solder paste. Flux reacts with the impurities and contaminants on the circuit surface (particularly oxides, dust and grime) and cleanses the surface of the board so the metal is primed for creating a good solder bond.
How Is Liquid Solder Flux Used?
Oxides are generally formed on circuit board surfaces when the metal they are made of reacts with oxygen. Presence of these oxides can make soldering a virtually impossible job. Application of flux is therefore, a preparatory step in the soldering process whereby the surfaces being bonded are first cleaned and primed with this chemical. The flux remains as a protective layer on the surface of the metal, preventing further oxidation until the soldering process is complete. Soldering, by definition, is a task carried out at high temperatures which are hot enough to vaporize any liquid flux residue on the surface, leaving the metals free and pristine for a proper chemical bond formation. Most SMT assembly processes also follow the practice of pre-heating the metal surfaces prior to solder paste application to prevent any liquid solder flux residue from being left behind.
You can get in touch with Alpha Assembly Solutions to find the type of liquid solder flux and recommended application process that is best suited for your SMT assembly operations.
What Does Liquid Solder Flux Do?
The process of soldering requires the formation of a metallurgical bond between two surfaces which chemically react with each other to achieve a stable and reliable bond. This bond is only possible when:
a. The solder alloy is chemically compatible with the surfaces being bonded together, and
b. The surfaces are free of any impurities that may physically and chemically hamper the formation of a good bond.
Point (b) in the assembly process is the responsibility of the liquid solder flux. Flux is a chemical that is applied to the surfaces being bonded together before application of the solder paste. Flux reacts with the impurities and contaminants on the circuit surface (particularly oxides, dust and grime) and cleanses the surface of the board so the metal is primed for creating a good solder bond.
How Is Liquid Solder Flux Used?
Oxides are generally formed on circuit board surfaces when the metal they are made of reacts with oxygen. Presence of these oxides can make soldering a virtually impossible job. Application of flux is therefore, a preparatory step in the soldering process whereby the surfaces being bonded are first cleaned and primed with this chemical. The flux remains as a protective layer on the surface of the metal, preventing further oxidation until the soldering process is complete. Soldering, by definition, is a task carried out at high temperatures which are hot enough to vaporize any liquid flux residue on the surface, leaving the metals free and pristine for a proper chemical bond formation. Most SMT assembly processes also follow the practice of pre-heating the metal surfaces prior to solder paste application to prevent any liquid solder flux residue from being left behind.
You can get in touch with Alpha Assembly Solutions to find the type of liquid solder flux and recommended application process that is best suited for your SMT assembly operations.
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