Electronic solder paste is invariably used in both mass SMT assembly as well as prototype circuit board creations. The material becomes one of the most viable solutions for creation of reliable, lasting and cost effective electrical interconnectivity bonds between different surfaces in a circuit assembly. The process followed to create this bond consists of a number of steps and stages. This blog post gives a brief insight to each step, helping you better understand the SMT assembly process and the intricacies involved.
The paste is made up of powdered metal that is mixed with a viscous substance known as flux. This flux usually acts as a temporary adhesive that allows the solder alloy to take position on the PCB surface. The metal in the paste is later melted as part of the soldering process thereby, creating the firm bond needed for circuit assembly.
The process begins with the application of the electronic solder paste onto the printed circuit board. In most manufacturing operations, electronic solder paste is applied to the PCB surface through the stencil with the help of a squeegee. The squeegee blade spreads the solder paste evenly on the surface while the stencil makes sure that the paste reaches only those parts of the circuit where a bond is required.
Once the application stage of the SMT assembly process is complete, the electronic solder paste covered circuit board is passed onto a pick-and-place machine. Here, different components of the circuit design are added to the board which are held in pace by the inherent surface tension of the electronic solder paste. The board is then heated to the solder alloy’s melting point so as to activate the metal in the paste and get it to firmly bond to the surfaces it is supposed to be joining. Subsequent cooling of the board results in the formation of a solid metal joint between surfaces with electrical and thermal conductive capabilities. This bond is reliable, resistant to thermal and mechanical fatigue, and can easily withstand issues like sheering.
And that is how electronic solder paste is used to create solid, lasting surface bonds between different components of a SMT assembly.
The paste is made up of powdered metal that is mixed with a viscous substance known as flux. This flux usually acts as a temporary adhesive that allows the solder alloy to take position on the PCB surface. The metal in the paste is later melted as part of the soldering process thereby, creating the firm bond needed for circuit assembly.
The process begins with the application of the electronic solder paste onto the printed circuit board. In most manufacturing operations, electronic solder paste is applied to the PCB surface through the stencil with the help of a squeegee. The squeegee blade spreads the solder paste evenly on the surface while the stencil makes sure that the paste reaches only those parts of the circuit where a bond is required.
Once the application stage of the SMT assembly process is complete, the electronic solder paste covered circuit board is passed onto a pick-and-place machine. Here, different components of the circuit design are added to the board which are held in pace by the inherent surface tension of the electronic solder paste. The board is then heated to the solder alloy’s melting point so as to activate the metal in the paste and get it to firmly bond to the surfaces it is supposed to be joining. Subsequent cooling of the board results in the formation of a solid metal joint between surfaces with electrical and thermal conductive capabilities. This bond is reliable, resistant to thermal and mechanical fatigue, and can easily withstand issues like sheering.
And that is how electronic solder paste is used to create solid, lasting surface bonds between different components of a SMT assembly.
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