Solder pastes have come a long way from formulations that contained lead to lead-free and halogen-free options. Solder paste with lead is still being used in certain applications that require a heavy-duty adhesive for circuitry, but some providers of SMT (Surface Mount Technology) assembly solutions already carry a wider range of solder pastes in different alloy offerings. An example would be the low-Ag solder paste, which is known for its good soldering performance at a lower cost. With the advancement in technology, the availability of solder pastes that fits your unique process and meets environmental regulations is becoming increasingly assessable.
Tin-lead (Sn/Pb) solder paste is formulated in different alloys to ensure good print volume repeatability while minimizing the variations in the print process. Some types of tin-lead soldering alloys reduce print cycle times as they speed up print speeds while extending the amount of prints between undercleaning stencils. These pastes can withstand lengthy and hot soak reflow profiles for excellent wetting of lead-free surfaces using a tin lead paste alloys.
Lead-free solder paste performs well in high throughput applications. It can be formulated for different performance indicators, such as low temp reflow, universal high print speed, high soak profile in through hole applications, and PoP (Package-on-Package) dip paste. Lead-free, halogen-free solder paste for low temperature reflow processes improves solder joint performance for thermal cycling and drop shock cycling.
Halogen-free solder paste is designed to eliminate finished products as possible sources of halogen, the by-product of incomplete combustion, which occurs in discarded electronic products and circuit boards. The hazardous material can contain furan-like compounds, corrosive and acidic gases, and dioxin, all of which are dangerous to human health and the environment.
Assembly of PCBs (Printed Circuit Boards) used in handheld devices like smartphones and tablets, as well as in military and aerospace equipment, medical devices, network servers, consumer electronic products, and automotive systems require advanced solder pastes specifically formulated for such applications.
Tin-lead (Sn/Pb) solder paste is formulated in different alloys to ensure good print volume repeatability while minimizing the variations in the print process. Some types of tin-lead soldering alloys reduce print cycle times as they speed up print speeds while extending the amount of prints between undercleaning stencils. These pastes can withstand lengthy and hot soak reflow profiles for excellent wetting of lead-free surfaces using a tin lead paste alloys.
Lead-free solder paste performs well in high throughput applications. It can be formulated for different performance indicators, such as low temp reflow, universal high print speed, high soak profile in through hole applications, and PoP (Package-on-Package) dip paste. Lead-free, halogen-free solder paste for low temperature reflow processes improves solder joint performance for thermal cycling and drop shock cycling.
Halogen-free solder paste is designed to eliminate finished products as possible sources of halogen, the by-product of incomplete combustion, which occurs in discarded electronic products and circuit boards. The hazardous material can contain furan-like compounds, corrosive and acidic gases, and dioxin, all of which are dangerous to human health and the environment.
Assembly of PCBs (Printed Circuit Boards) used in handheld devices like smartphones and tablets, as well as in military and aerospace equipment, medical devices, network servers, consumer electronic products, and automotive systems require advanced solder pastes specifically formulated for such applications.
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