Surface mount electronics used in demanding environments increases the importance of the solder joints’electrical reliability. It is important to ensure that solder joints are reliable and perform well when exposed to thermal expansion incongruities. Such discrepancies can make solder joints less reliable. To prevent these problems, manufacturers and providers of SMT (Surface Mount Technology) assembly products offer higher-quality solder material that is non-corrosive to stop oxidation, grain structure stability and prevent the buildup of fatigue damage.
Lead-free, no-clean, zero-halogen solder paste is designed for assembly processes that require passing the JIS Copper Corrosion test and residue with good pin testing property. It enables electrical reliability by making sure that fine pitch printing is accurate, down to 180µm circle printed, with a stencil that is 100µm thick. Excellent print volume repeatability adds value by minimizing defects, which occur with variability in the print process. It should achieve the IPC7095 Class III voiding performance, too.
High-quality lead-free and halogen-free solder paste ensure long stencil life and consistent performance for a minimum of eight hours when printing continuously, without adding new paste. High and long tack force life ensures good self-alignment and high pick-and-place yields, and the wide reflow profile generates the highest-quality solderability for high density and complex assemblies in nitrogen and air reflow, with soak and ramp profile temperatures ranging from 175°C to 185°C. Apart from ensuring electrical reliability, the solder reduces random ball solder levels to minimize the need for rework and to increase first time yield.
Electrical reliability in ultra-fine applications require solder that can guarantee superb printing performance down to a pad size of 180μm. This type of solder comes in lead-free, zero-halogen, and no-clean formulations for ultra-fine feature printing and air reflow. Such solder pastes are also ideal for assemblies with components that are sensitive to warpage.
Lead-free, no-clean, zero-halogen solder paste is designed for assembly processes that require passing the JIS Copper Corrosion test and residue with good pin testing property. It enables electrical reliability by making sure that fine pitch printing is accurate, down to 180µm circle printed, with a stencil that is 100µm thick. Excellent print volume repeatability adds value by minimizing defects, which occur with variability in the print process. It should achieve the IPC7095 Class III voiding performance, too.
High-quality lead-free and halogen-free solder paste ensure long stencil life and consistent performance for a minimum of eight hours when printing continuously, without adding new paste. High and long tack force life ensures good self-alignment and high pick-and-place yields, and the wide reflow profile generates the highest-quality solderability for high density and complex assemblies in nitrogen and air reflow, with soak and ramp profile temperatures ranging from 175°C to 185°C. Apart from ensuring electrical reliability, the solder reduces random ball solder levels to minimize the need for rework and to increase first time yield.
Electrical reliability in ultra-fine applications require solder that can guarantee superb printing performance down to a pad size of 180μm. This type of solder comes in lead-free, zero-halogen, and no-clean formulations for ultra-fine feature printing and air reflow. Such solder pastes are also ideal for assemblies with components that are sensitive to warpage.
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