Soldering two surfaces or components together involves fusing the two surfaces together using a soldering alloy, by melting it and forming a connection between them. Since this activity consists in melting the solder, there is a very high temperature at the surfaces. Now if the components or the surfaces to be connected are not prepared to resist this heat of the molten alloy, there could be considerable damage to the elements. It is for this reason that low-temperature solder alloys are used for sensitive applications. This blogpost will explore the benefits of using low melting point solders.
First, low-temperature solder alloys prevent any damage that could happen to the components and the printed circuit board. Since these alloys are never heated up to very high temperatures for melting, there is no burning of the circuit board or the components.
Secondly, using low temperature solder alloys directly translates into energy savings. The soldering iron does not need to be heated up to very high temperatures to melt the solder alloy. It thus consumes lesser electricity. In case of industrial manufacturing, these little savings convert into a massive amount of money saved in electricity bills.
Thirdly, low temperature alloys are known to perform better in thermal cycling tests, impact resistance and durability. These alloys also help in reducing the number of steps required to complete the surface mount technology process.
Low temperature alloys are more versatile for use over different materials of printed circuit boards since they have the lesser potential to damage the surfaces they touch. Some special plastics that are used to make printed circuit boards usually don’t work well with high temperature solders, which is why low temperature solders are employed.
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