Common Questions about Low Melting Point Solder

Almost all electronics used these days employ printed circuit boards (PCBs) in some way. Most of printed circuit boards require working at high temperatures because of the higher temperature needs of underlying soldering application. However, not all applications require or can work efficiently at such high temperatures – which is why low temperature solders were developed. These solders are alloys that melt at comparatively lower temperatures so that the components housed on the board do not suffer from heat damage. Here are answers to some of the common questions about the low melting point solder.

The most common question that comes up often is about the type of alloys used for low temperature soldering. Technically, these alloys have a comparatively lower melting point than other kinds of solder alloys. Therefore, they are employed extensively in step soldering processes. This is a process where different assemblies and sub-assemblies have to be soldered sequentially, without melting the previously soldered joint. This can be done by successively using solders of decreasing melting points for each subassembly.

The second most commonly asked question is about the conductivity of low melting point solders.  It has been observed that low melting point solders have a very good thermal and electrical conductivity. They are sometimes even used for heat exchange processes because of this very property.

The fact that these alloys are mostly liquid makes them highly desirable to work with because of their wetting properties. Low-temperature solder alloys are beginning to make their mark in the soldering industry.