Powerful LEDs must be capable of operating at increasing power and current levels, especially when they are used in mobile flash, lighting, and other similar applications. This need encouraged the importance of robust thermal dissipation, as heat must dissipate properly to prevent the degradation of LED performance that can result in changes in the forward voltage, loss of flux, reduced lifetime, and wavelength shift. Die-attach was developed to ensure sufficient thermal stability and performance. Along with the use of proper LED flux, die-attach should be more efficient in managing light extraction, LED light output, and the maintenance of lumens over time.
LED flux is an important aspect of the die-attach process. The quality of the flux and the die-attach material should have an effect on the light engine’s cost of ownership. Hence, they should be made with an understanding of LED technology. Experienced providers of die-attach materials take time to consider manufacturing process before recommending dedicated bonding materials that can cover die-attach for vertical, lateral, and flip-chips on board.
As with any die-attach product, LED flux must be able to address key issues related to the lifespan, reliability, brightness, efficiency, and thermal management of LED lighting. Solder paste with Sn10Sb alloy is an off-eutectic solder with a high melting point (liquidus of 251°C and solidus of 245°C) that is designed for die-attach and SMT interconnects. It is ideal for low voiding die-attach LED applications that require the product to be able to handle secondary reflow. Solder flux for LED applications must have good wetting characteristics, minimal voiding, easy to clean, long open times and should ensure enough tack for component mounting.
Some types of low-temperature solder pastes can be formulated for applications involving LED package-on-flex reflow, like on PET flexible substrates. For these applications, the solder paste’s melting point stays below 140°C, yet it remains useful with peak reflow profiles ranging from 155°C to 190°C. Low-temperature solder pastes provide drop shock resistance and enhanced mechanical strength for components, too.
LED flux is an important aspect of the die-attach process. The quality of the flux and the die-attach material should have an effect on the light engine’s cost of ownership. Hence, they should be made with an understanding of LED technology. Experienced providers of die-attach materials take time to consider manufacturing process before recommending dedicated bonding materials that can cover die-attach for vertical, lateral, and flip-chips on board.
As with any die-attach product, LED flux must be able to address key issues related to the lifespan, reliability, brightness, efficiency, and thermal management of LED lighting. Solder paste with Sn10Sb alloy is an off-eutectic solder with a high melting point (liquidus of 251°C and solidus of 245°C) that is designed for die-attach and SMT interconnects. It is ideal for low voiding die-attach LED applications that require the product to be able to handle secondary reflow. Solder flux for LED applications must have good wetting characteristics, minimal voiding, easy to clean, long open times and should ensure enough tack for component mounting.
Some types of low-temperature solder pastes can be formulated for applications involving LED package-on-flex reflow, like on PET flexible substrates. For these applications, the solder paste’s melting point stays below 140°C, yet it remains useful with peak reflow profiles ranging from 155°C to 190°C. Low-temperature solder pastes provide drop shock resistance and enhanced mechanical strength for components, too.
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