Solder alloys are manufactured with different melting temperatures ranging from 47°C to 1064°C. Hence, when selecting the right alloy, you need to consider the maximum temperature the components can stand, the required thermal properties, and the device’s ultimate operating temperature. It’s also important to keep in mind other factors, such as CTE mismatch, and other requirements, like if lead-free materials are mandated. Lead-free low-temperature solder is one of the widely-used materials in many joining applications, including the manufacture of PCBs using the surface mount method, because of the value they provide to the electronic assembly process.
Solder for low-temperature processing is made of the SAC alloy, particularly for the latest dual alloy SMT process on the assembly’s top side. When the boards are flipped, CVP-520 is used for the printing. Larger areas of overprint or solder preforms may be required to guarantee proper hole fill when applying plated through-hole components. Low-temperature solders are used in applications where the use of high-temperature solders can result in failure in electronics interconnecting. It may be required for Large area array devices (i.e. BGAs) to prevent non-wet-open failures, temperature-sensitive components (i.e. MEMS devices, crystal oscillators, and III/V semiconductors), and low-Tg or low-melting flex circuitry on smartwatches, IoT devices, and smartwatches.
Low-melting lead-free solders may be utilized for safety reasons, particularly in the manufacture of fire detection devices and food preparation thermometers. Some types of specialty electrical fuses may use low-temperature lead-free solder, too. The material and the process are found to enhance secondary soldering, which makes select components suitable for reworking. RF shields and components that must be soldered separately require a rework process that will enable the components to be tested prior to reworking. That way, components can be removed for reheating without damaging the surrounding parts. The process may provide more value by minimizing process energy, labor, and materials cost, too.
Solder for low-temperature processing is made of the SAC alloy, particularly for the latest dual alloy SMT process on the assembly’s top side. When the boards are flipped, CVP-520 is used for the printing. Larger areas of overprint or solder preforms may be required to guarantee proper hole fill when applying plated through-hole components. Low-temperature solders are used in applications where the use of high-temperature solders can result in failure in electronics interconnecting. It may be required for Large area array devices (i.e. BGAs) to prevent non-wet-open failures, temperature-sensitive components (i.e. MEMS devices, crystal oscillators, and III/V semiconductors), and low-Tg or low-melting flex circuitry on smartwatches, IoT devices, and smartwatches.
Low-melting lead-free solders may be utilized for safety reasons, particularly in the manufacture of fire detection devices and food preparation thermometers. Some types of specialty electrical fuses may use low-temperature lead-free solder, too. The material and the process are found to enhance secondary soldering, which makes select components suitable for reworking. RF shields and components that must be soldered separately require a rework process that will enable the components to be tested prior to reworking. That way, components can be removed for reheating without damaging the surrounding parts. The process may provide more value by minimizing process energy, labor, and materials cost, too.
No comments:
Post a Comment