Selective soldering can be a cost-effective means to assemble printed circuit boards using through-hole technology. Despite the increasing popularity of surface mount technology, through-hole technology remains preferred in certain applications, although they can be cumbersome. In that case, selective soldering may help simplify the process while ensuring cost-effective and precise results. Selective soldering may be necessary for parts that could get damaged by heat from the reflow oven, which is used in the SMT assembly process.
Types of Selective Soldering Techniques:
• Manufacturers follow standard assembly processes in selective soldering. Selective aperture tooling over wave solder is a process where tools ignore areas that have been previously soldered by an SMT process. Hence, only the areas that are yet to be soldered are treated in the window or aperture. The PCB assembly is then delivered to the wave soldering equipment to finish the entire process.
• Another type of selective aperture soldering is the mass selective dip solder fountain. It uses a special tool with apertures that lets the solder to be pumped through, and represents the areas that must be soldered. After soldering, the printed circuit board is delivered to a selective solder fountain and every aspect of the PCB’s selective soldering is conducted simultaneously.
Laser soldering is the latest process in selective soldering and it can import CAD-based layouts to be used in positioning the laser directly to solder any point on a PCB. It eliminates thermal stress while ensuring flexibility and high-quality and consistent solder joints.
Types of Selective Soldering Techniques:
• Manufacturers follow standard assembly processes in selective soldering. Selective aperture tooling over wave solder is a process where tools ignore areas that have been previously soldered by an SMT process. Hence, only the areas that are yet to be soldered are treated in the window or aperture. The PCB assembly is then delivered to the wave soldering equipment to finish the entire process.
• Another type of selective aperture soldering is the mass selective dip solder fountain. It uses a special tool with apertures that lets the solder to be pumped through, and represents the areas that must be soldered. After soldering, the printed circuit board is delivered to a selective solder fountain and every aspect of the PCB’s selective soldering is conducted simultaneously.
Laser soldering is the latest process in selective soldering and it can import CAD-based layouts to be used in positioning the laser directly to solder any point on a PCB. It eliminates thermal stress while ensuring flexibility and high-quality and consistent solder joints.
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