You are likely to come across no-clean solder paste when choosing
materials for your soldering and PCB assembly needs. Its purpose is to
eliminate the need to clean the printed circuit boards after the soldering
process, but with some products still requiring you to clean the board, you
might be wondering what ‘no-clean’ actually means. In some cases, the no-clean
variant will still require you to do some cleaning. A manufacturer may have
adjusted their assembly lines to use this type of solder paste, then clean only
the boards that require cleaning. So what does ‘no-clean’ mean then?
In a no-clean
solder paste, ‘no-clean’ actually means solder paste with minimal
residue. After reflow, flux will still leave a small amount of resinous but non-corrosive
residue around or on the solder joints. The residue may vary in color, usually appearing
amber or transparent, depending on the flux resin used and the reflow
temperature. The amount of residue will depend on the amount of the activators,
gelling agents, and the solid resins in the flux. So, the less solids content
it has, the less flux residue on the board. Contemporary no-clean solder pastes
contain around 50 to 70 percent of solids.
‘No-clean’ may also pertain to the solder
paste leaving a clean look, making it as good as a water-soluble paste. But why
remove residue from a no-clean solder
paste from a PCB? One reason is to minimize problems during in-circuit
testing, as the test pins are unable to go through the flux and establish and
electrical connection with test pads. Moreover, residue could build up
gradually on the pins and cause issues with test accuracy and maintenance.
However, you do not have to worry about those problems when you use high-quality
no-clean solder paste
with recent formulations.